MEMORY DEVICE HAVING STITCHED ARRAYS OF 4 F+hu 2 +l MEMORY CELLS

ABSTRACT

A memory device comprises a semiconductor substrate having a plurality of parallel trenches therein, a memory region formed in the substrate including an array of memory cells having a plurality of vertical selection transistors with respective channels formed in trench sidewalls, a plurality of buried source electrodes in trench bottoms, a plurality of paired gate electrodes formed on paired trench sidewalls, a first and second stitch region disposed adjacent the memory region along a trench direction including a first and second row of gate contacts, respectively, and a row of source contacts disposed in the first or second stitch region with each of the source contacts coupled to a respective one of the source electrodes. One of each pair of the gate electrodes is coupled to a respective one of the first row of gate contacts and the other one of each pair of gate electrodes is coupled to a respective one of the second row of gate contacts.

RELATED APPLICATIONS

The present application is a continuation of the commonly assignedapplication bearing Ser. No. 13/680,037 filed Nov. 17, 2012, entitled“MEMORY DEVICE HAVING STITCHED ARRAYS OF 4 F² MEMORY CELLS,” whichclaims the benefit of the provisional application bearing Ser. No.61/562,309, filed Nov. 21, 2011.

FIELD OF THE INVENTION

The present invention relates to semiconductor memory architectures,particularly to memory devices having stitched arrays of memory cells.

BACKGROUND OF THE INVENTION

Resistive memory is a new class of non-volatile memory, which can retainthe stored information when powered off. A resistive memory devicenormally comprises an array of memory cells, each of which includes atleast a resistive memory element and a selection element coupled inseries between appropriate electrodes. Upon application of anappropriate voltage or current to the resistive memory element, theelectrical resistance of the resistive memory element would changeaccordingly, thereby switching the stored logic in the respective memorycell.

A resistive memory element can be classified into at least one ofseveral known groups based on its resistively switching mechanism. Theresistive memory element of Phase Change Random Access Memory (PCRAM)may comprise a phase change chalcogenide compound, which can switchbetween a resistive amorphous phase and a conductive crystalline phase.The resistive memory element of Conductive Bridging Random Access Memory(CBRAM) relies on the statistical bridging of metal rich precipitatestherein for its switching mechanism. The resistive memory element ofCBRAM normally comprises a nominally insulating metal oxide material,which can switch to a lower electrical resistance state as the metalrich precipitates grow and link to form conductive paths uponapplication of an appropriate voltage. The resistive memory element ofMagnetoresistive Random Access Memory (MRAM) typically comprises atleast two layers of different ferromagnetic materials with anon-magnetic spacer layer interposed therebetween. When a switchingpulse is applied to the memory element of a MRAM device, one of theferromagnetic layers will switch its magnetic field polarity, therebychanging the element's electrical resistance.

A selection element in a memory cell functions like a switch to directcurrent through the selected memory element coupled thereto. One commonselection element is diode, which can reverse bias a non-selected memorycell. While a selection diode has a simple structure that can minimizethe cell size of the resistive memory cell, a memory architectureemploying the selection diode normally has a slower random access time.Another commonly used selection element is transistor, which allows forfaster selection of memory cells and therefore faster random accesstime. While a memory device employing the selection transistor is moresuitable for the random access type of memories, the more complicatedstructure of the selection transistor means the size of the memory cellwill be larger, which translates to a lower cell density. Moreover, thememory device utilizing the selection transistor needs additional wiringfor controlling the gate electrode, further complicating the scaling ofthe device.

To be cost competitive, a small memory cell size is desired in order toincrease device density. One way to achieve this is to simply shrink thefeature size, F, normally associated with a particular lithographyprocess. However, several difficulties can arise when scaling down aconventional transistor, particularly its channel length, to sizes of afew tens of nanometers. As the channel length is reduced, there is apropensity for the formation of parasitic conduction paths betweensource and drain, thereby causing punch through current leakages.Another obstacle encountered in shrinking the conventional transistor isreduced current drivability caused by the reduced width of the currentcarrying channel. This is a significant issue for resistive memorydevices, which require higher current to switch their memory state.

Another approach to reduce the memory cell size is to use a differentarchitecture that would permit the memory cell size to scale down whileincreasing the channel width and length to mitigate the above mentionedproblems associated with shrinking feature size. With the source, drain,and channel of the conventional selection transistor lie on a sameplane, the conventional resistive memory cell size is limited to 8 F².As would be understood by one of ordinary skill in the art, the minimumpitch between two repetitive features on a same mask layer is 2 F.Accordingly, the minimum size of a memory cell would be 4 F² whenarranged in a square array using conventional lithography.

To attain a cell size of 4 F² would require the channel of the selectiontransistor to be placed in such a way that allows the current to flow ina vertical direction perpendicular to the substrate plane. FIG. 1illustrates a memory device having an array of 4 F² memory cells 80,each of which comprising a memory element 82 connected to a verticalselection transistor 84 by way of a contact stud 86. The verticalselection transistor 84 includes a drain region 88 disposed on top of atrench sidewall, a shared source region 90 disposed on the trenchbottom, and a gate 92 formed on the trench sidewall, enabling current toflow vertically between the shared source 90 and drain region 88 by wayof a vertical channel formed on the sidewall. It should be noted thatwhile the memory cells 80 in FIG. 1 can be arranged to have a size of 4F², the design and placement of gate, source, and bit electrodesconnected to the cells is critical in preserving this minimum memorycell size for memory devices wherein multiple electrodes pass througheach memory cell. Moreover, local gate, source, and bit electrodescoupled to an array of memory cells need to be connected to main wiringlines, such as word lines, bit lines, and source lines. For the 4 F²memory array illustrated in FIG. 1 wherein each cell has a cross sectiondimension of 2 F to accommodate a gate electrode and a source electrodein a same direction, it remains a challenge to construct the connectionsbetween the local electrodes and the main wiring lines such that bothlayout complexity and space usage are minimized.

SUMMARY OF THE INVENTION

The present invention provides a stitching architecture for connectinglocal electrodes of memory arrays having 4 F² memory cells to maindevice wiring lines while minimizing both layout complexity and spaceusage.

Accordingly, an object of the present invention is to provide a novelresistive memory device having a memory region and corresponding stitchregions.

Another object of the present invention is to provide a novel resistivememory device having stitched arrays of 4 F² memory cells connected todevice word lines and source lines.

Therefore, according to one aspect of the present invention, a memorydevice comprises a semiconductor substrate having a plurality ofparallel trenches therein, each of the trenches having a respective oneof a plurality of trench bottoms and a respective pair of a plurality ofpaired trench sidewalls; a memory region formed in the semiconductorsubstrate including an array of memory cells having a plurality ofvertical selection transistors with respective channels formed in thetrench sidewalls; a plurality of buried source electrodes in the trenchbottoms coupled to the memory cells along a first directionsubstantially parallel to the trenches; a plurality of parallel bitlines coupled to the memory cells along a second direction substantiallyorthogonal to the first direction; a plurality of paired gate electrodesformed on the paired trench sidewalls, the gate electrodes coupled tothe memory cells along the first direction; a first and a second stitchregion disposed adjacent the memory region along the first directionincluding a first and a second row of gate contacts formed in thetrenches along the second direction, respectively; and a row of sourcecontacts disposed in the trenches in the first or the second stitchregion, each of the source contacts coupled to a respective one of theburied source electrodes, wherein one of each pair of the gateelectrodes formed on a respective pair of the trench sidewalls iscoupled to a respective one of the first row of gate contacts disposedin a respective one of the trenches and the other one of each pair ofthe gate electrodes is coupled to a respective one of the second row ofgate contacts disposed in the respective one of the trenches.

According to another aspect of the present invention, a memory devicecomprises a plurality of memory arrays formed in a semiconductorsubstrate along a first direction with each of the memory arraysincluding a memory region comprising an array of memory cells arrangedin a square array with a pitch of 2 F in a second directionsubstantially perpendicular to the first direction, a first and a secondstitch region disposed adjacent the memory region along the firstdirection having a first and second row of gate contacts disposedtherein, respectively, the first and second row of gate contacts beingarranged along the second direction with a pitch of 4 F, each of thefirst and second row of gate contacts being connected to a respectiverow of the memory cells along the first direction, and a row of sourcecontacts arranged along the second direction with a pitch of 4 F in thefirst or second stitch region, each of the row of source contacts beingconnected to two respective rows of the memory cells along the firstdirection; a first and second plurality of word lines extending alongthe first direction; and a plurality of source lines extending along thefirst direction, wherein each row of the first and second row of gatecontacts of each of the memory arrays are coupled to the first or secondplurality of word lines, and the row of source contacts of each of thememory arrays are coupled to the plurality of source lines.

According to yet another aspect of the present invention, a memorydevice comprises a semiconductor substrate having a plurality ofparallel trenches therein, each of the trenches having a respective oneof a plurality of trench bottoms and a respective pair of a plurality ofpaired trench sidewalls; a plurality of memory arrays formed in thesemiconductor substrate, each of the memory arrays including a memoryregion comprising an array of memory cells having a plurality ofvertical selection transistors with respective channels formed in thetrench sidewalls, a plurality of buried source electrodes in the trenchbottoms coupled to the memory cells along a first directionsubstantially parallel to the trenches, a plurality of parallel bitlines coupled to the memory cells along a second direction substantiallyorthogonal to the first direction, a plurality of paired gate electrodeson the paired trench sidewalls coupled to the memory cells along thefirst direction, a first and a second stitch region disposed adjacentthe memory region along the first direction including a first and asecond row of gate contacts formed in the trenches along the seconddirection, respectively, and a row of source contacts disposed in thetrenches in the first or the second stitch region with each of thesource contacts coupled to a respective one of the buried sourceelectrodes, wherein one of each pair of the gate electrodes formed on arespective pair of the trench sidewalls is coupled to a respective oneof the first row of gate contacts disposed in a respective one of thetrenches and the other one of each pair of the gate electrodes iscoupled to a respective one of the second row of gate contacts disposedin the respective one of the trenches, and each of the trenches has arespective one of the first row of gate contacts, a respective one ofthe second row of gate contacts, and a respective one of the sourcecontacts disposed therein; a plurality of parallel source lines coupledto the source contacts of the memory arrays along the first direction;and a first and a second plurality of parallel word lines coupled to thegate contacts of the memory arrays along the first direction, whereinone of each pair of the gate electrodes formed on a respective pair ofthe trench sidewalls is connected to a respective one of the firstplurality of word lines and the other one of each pair of the gateelectrodes is connected to a respective one of the second plurality ofword lines.

The objects, features, aspects, and advantages of the present inventionare readily apparent from the following detailed description of thepreferred embodiments for carrying out the invention when taken inconnection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating an array of 4 F² memory cells,each of which comprising a memory element connected to a verticalselection transistor by way of a contact stud;

FIG. 2 is a top view of the present invention as applied to a memorydevice having a first and a second stitch region and a memory regionincluding an array of 4 F² memory cells;

FIGS. 3A-3D are various cross sectional views corresponding to thememory device illustrated in FIG. 2;

FIGS. 4A and 4B are top views corresponding to two levels of a memorydevice comprising a plurality of memory arrays coupled to two sets ofword lines in accordance to an embodiment of the present invention; and

FIGS. 5A and 5B are top views corresponding to two levels of a memorydevice comprising a plurality of memory arrays coupled to two sets ofword lines in accordance to another embodiment of the present invention.

FIG. 6 is a top view of a memory device comprising a plurality ofparallel source lines coupled to source contacts in accordance to anembodiment of the present invention.

For purposes of clarity and brevity, like elements and components willbear the same designations and numbering throughout the Figures, whichare not necessarily drawn to scale.

DETAILED DESCRIPTION OF THE INVENTION

The present invention provides memory devices having 4 F² memory cells,including means for connecting arrays of memory cells to main wiringlines and to each other.

An embodiment of the present invention as applied to a memory devicehaving an array of 4 F² memory cells will now be described withreference to FIG. 2 and FIGS. 3A-3D. FIG. 2 is a top view and FIGS.3A-3D are corresponding cross sectional views of a memory array 100. Inthese drawings the insulation material separating various elements isomitted for reasons of clarity. With continuing reference to FIG. 2 andFIGS. 3A-3D, the illustrated memory array 100 comprises a semiconductorsubstrate 102 having a plurality of parallel trenches 104 therein, eachof the trenches having a respective one of a plurality of trench bottoms106 and a respective pair of a plurality of paired trench sidewalls 108;a memory region 110 formed in the semiconductor substrate 102 includingan array of memory cells 112 having a plurality of vertical selectiontransistors 114 with respective channels formed in the trench sidewalls108 (FIG. 3A); a plurality of paired gate electrodes 116 disposed on thetrench sidewalls 108 and coupled to the memory cells 112 along a firstdirection parallel to the trenches 104; a plurality of buried sourceelectrodes 118 formed in the trench bottoms 106 and coupled to thememory cells 112 along the first direction; a plurality of parallel bitlines 130 coupled to the memory cells 112 in a second directionsubstantially orthogonal to the first direction; a first stitch region120 and a second stitch region 122 disposed adjacent the memory region110 along the first direction including a first row of gate contacts 124and a second row of gate contacts 126, respectively, formed in thetrenches 104 along the second direction; a row of source contacts 128disposed in the trenches 104 along the second direction in the firststitch region 120 or the second stitch region 122, wherein each of thesource contacts 128 is coupled to a respective one of the buried sourceelectrodes 118. One of each pair of the gate electrodes 116 formed on arespective pair of the trench sidewalls 108 is coupled to a respectiveone of the first row of gate contacts 124 disposed in a respective oneof the trenches 104 and the other one of each pair of the gateelectrodes 116 is coupled to a respective one of the second row of gatecontacts 126 disposed in the respective one of the trenches 104. Each ofthe trenches 104 in the memory array 100 has a respective one of thefirst row of gate contacts 124, a respective one of the second row ofgate contacts 126, and a respective one of the source contacts 128disposed therein. The memory array 100 may also include a firstplurality of substrate contacts 132 and a second plurality of substratecontacts 133 coupled to the substrate 102 for grounding or controllingthe electrical potential thereof in the first stitch region 120 and thesecond stitch region 122, respectively. A plurality of parallelsubstrate lines 142 are coupled to the substrate contacts 132 and 133 inthe second direction substantially orthogonal to the first direction.

In one embodiment, the memory cells 112 in the memory region 110 arearranged in a square array with a pitch of 2 F in the first and seconddirection, resulting in a cell size of 4 F². Accordingly, the sourcecontacts 128 and the gate contacts 124 and 126 are arranged to have apitch of 4 F in the second direction. Although only some exemplary rowsof memory cells are shown in FIG. 2, it should be understood that thememory array 100 may have as many rows of memory cells in the first andsecond direction as needed.

Referring now to FIG. 3A, which shows the cross sectional view of thememory cells 112. Each of the memory cells 112 comprises a respectiveone of a plurality of memory elements 134 coupled to a respective one ofthe vertical selection transistors 114 by way of a respective one of thecontact studs 136. Each of the vertical selection transistors 114includes a respective one of a plurality of drain regions 138 formed ontop of a respective one of the trench sidewalls 108 and a verticalchannel formed in the respective one of the trench sidewalls 108adjacent a respective one of the gate electrodes 116 with a thin gatedielectric layer (not shown) interposed therebetween. Each of the buriedsource electrodes 118 acts as a common source coupled to a respectivepair of the transistors 114 formed on a respective pair of the trenchsidewalls 108, that is source electrode 118A is coupled to transistors114A/114B and source electrode 118B is coupled to transistors 114C/114D.When an appropriate potential is applied to one of the gate electrodes116, charge carriers flows vertically from a respective one of thesource electrodes 118 to a respective one of the drain regions 138 byway of a respective channel formed in a respective one of the sidewalls108. The conducting channel may be unique to a respective one of thetransistors 114 or may be shared by a respective row of the transistors114 disposed on a respective one of the trench sidewalls 108 asdisclosed in U.S. patent application Ser. No. 13/438,845. Each of theparallel bit lines 130 is coupled to a respective row of the memoryelements 134 along the second direction. The parallel trenches 104 areseparated by a plurality of trench isolation regions 140. It should benoted that the gate electrodes 116 are separated from the buried sourceelectrodes 118 by the thin gate dielectric layer covering the trenchbottoms 106 and the trench sidewalls 108.

The substrate 102 can be any p-type semiconductor substrate known in theart, such as silicon (Si), silicon germanium (SiGe), silicon carbide(SiC), SiCGe, II-VI compounds, III-V compounds, or semiconductingepitaxial layers over such substrates, thereby forming the selectiontransistors 114 with a n-type channel. In one embodiment, thesemiconductor substrate 102 comprises silicon. Each of the paralleltrenches 104, which may be formed by etching into the substrate 102, hasa respective one of the trench bottoms 106 and a respective pair of thepaired trench sidewalls 108. The buried source electrodes 118 having then-type conductivity may be formed by ion implantation into the trenchbottoms 106 with any suitable dopant, such as phosphorous, arsenic, orantimony. The drain regions 138 having the n-type conductivity areformed by ion implantation into top portion of the trench sidewalls 108with any suitable dopant, such as phosphorous, arsenic, or antimony. Thebottom of the drain regions 138 is preferably positioned below top ofthe gate electrodes 116. The gate dielectric layer lining the trenchsidewalls 108 preferably has a thickness of between 0.5-5 nm and maycomprise any material with sufficiently high dielectric constant,including but not limited to SiO_(x), SiO_(x)N_(y), hafnium oxide(HfO_(x)), hafnium oxynitride (HfO_(x)N_(y), hafnium silicate(HfSiO_(x)), HfSiO_(x)N_(y), zirconium oxide (ZrO_(x)), zirconiumoxynitride (ZrO_(x)N_(y)), zirconium silicate (ZrSiO_(x)),ZrSiO_(x)N_(y), aluminum oxide (AlO_(x)), or combinations thereof. Thegate dielectric layer may also be formed by thermal oxidation of thetrench sidewalls 108 or by any suitable thin film deposition method,such as CVD or ALD.

The gate electrodes 116 are formed on the trench sidewalls 108 with thegate dielectric layer interposed therebetween. The height of the gateelectrodes 116, which defines the length of the channels, is lower thanthe height of the trench sidewalls 108. When an appropriate voltage isapplied to one of the gate electrodes 116, an electric field is inducedacross the gate dielectric layer to modulate the conductance of arespective channel formed in a respective one of the vertical trenchsidewalls 108, thereby allowing charge carriers to move verticallybetween a respective one of the source electrodes 118 and a respectiveone of the drain regions 138. The gate electrodes 116 may be formed byfirst depositing one or more layers of conductors on the trenchsidewalls 108 using a conformal thin film deposition method, such asChemical Vapor Deposition (CVD) or Atomic Layer Deposition (ALD), andfollowed by Reactive Ion Etching (RIE) to define the electrode height.The gate electrodes 116 may comprise one or more layers of any suitableconductive material, such as doped polysilicon, tungsten silicide(WSi_(x)), titanium silicide (TiSi_(x)), cobalt silicide (CoSi_(x)),nickel silicide (NiSi_(x)), tantalum nitride (TaN_(x)), titanium nitride(TiN_(x)), tantalum (Ta), tungsten (W), or combinations thereof.

A function of the contact studs 136 is to provide Ohmic contact for thedrain regions 138 of the vertical selection transistors 114, therebydecreasing the contact resistance. Each of the contact studs 136 isdisposed on top of a respective one of the drain regions 136. Thecontact studs 136 may comprise one or more layers of any suitableconductive material, such as tungsten silicide (WSi_(x)), titaniumsilicide (TiSi_(x)), cobalt silicide (CoSi_(x)), nickel silicide(NiSi_(x)), tantalum nitride (TaN_(x)), titanium nitride (TiN_(x)),tantalum (Ta), tungsten (W), titanium (Ti), palladium (Pd), platinumsilicide (PtSi), Indium (In), or combinations thereof. The contact studs136 may be formed by depositing any suitable conductive material by ALDor CVD into previously formed contact holes and followed by ChemicalMechanical Polishing (CMP) to remove excess material.

Each of the memory elements 134 is disposed on top of a respective oneof the contact studs 136. The memory elements 134 may switch theirresistance state by any suitable switching mechanism, such as phasechange, precipitate bridging, magnetoresistive switching, orcombinations thereof. In one embodiment, the resistive memory elements134 comprise a phase change chalcogenide compound, such as Ge₂Sb₂Te₅ orAgInSbTe, which can switch between a resistive amorphous phase and aconductive crystalline phase. In another embodiment, the resistivememory elements 134 comprise a nominally insulating metal oxidematerial, such as NiO, TiO₂, or Sr(Zr)TiO₃, which can switch to a lowerelectrical resistance state as the metal rich precipitates grow and linkto form conductive paths upon application of an appropriate voltage. Inyet another embodiment, the resistive memory elements 134 comprise atleast two layers of ferromagnetic materials with a non-magnetic spacerlayer interposed therebetween. When a switching pulse is applied, one ofthe ferromagnetic layers will switch its magnetic field polarity,thereby changing the element's electrical resistance.

The fabrication method for the memory region 110, including the memorycells 112, the gate electrodes 116, and the buried source electrodes118, has been disclosed in U.S. patent application Ser. No. 13/438,845,which is incorporated herein by reference. In short, the methodcomprises the steps of providing a semiconductor substrate having thep-type conductivity and a pad layer thereon; forming a plurality ofparallel trench isolation regions through the pad layer in thesubstrate; removing the pad layer to partially expose the paralleltrench isolation regions; forming a hard mask self-aligned to theparallel trench isolation regions; forming a plurality of paralleltrenches in between the trench isolation regions by selectively etchingthe substrate having the hard mask thereon, each of the trenches havinga respective one of a plurality of trench bottoms and a respective pairof a plurality of trench sidewalls; conformally forming a gatedielectric layer over the trenches; forming a plurality of gateelectrodes on the trench sidewalls with the gate dielectric interposedtherebetween; forming a plurality of n-type parallel source electrodesin the trench bottoms by ion implantation; forming an interlayerdielectric layer by filling and covering the trenches; forming aplurality of contact holes through the interlayer dielectric layer withthe contact holes being aligned to top of the trench sidewalls; forminga plurality of n-type drain regions in the trench sidewalls by ionimplantation through the contact holes; forming a plurality of contactstuds on the drain regions by filling the contact holes with aconductive material; forming a plurality of resistive memory elements onthe contact studs; and forming a plurality of parallel bit lines coupledto respective rows of the memory elements along a directionperpendicular to the source electrodes.

Referring now to FIG. 3B, which shows the cross sectional view of thefirst row of gate contacts 124 in the first stitch region 120. The gatecontacts 124 are disposed in the trenches 104 and are coupled to thegate electrodes 116. It should be noted that the paired gate electrodes116 on the trench sidewalls 108 are connected at the trench bottoms 106here to enhance physical and electrical contact between the gateelectrodes 116 and the gate contacts 124. The bottoms of the gateelectrodes 116 are left intact by masking the gate contact regionsduring the etching process to form the paired gate electrodes 116 in thememory region 110 (FIG. 2B). While the current cross sectional viewshows each of the gate contacts 124 is coupled to a respective pair ofthe gate electrodes 116 in the first stitch region 120, the top view inFIG. 2 shows that one of the respective pair of the gate electrodes 116is severed near the gate contact region during processing. Therefore,each of the gate contacts 124 is coupled to one of a respective pair ofthe gate electrodes 116, that is gate contacts 124A and 124B are coupledto gate electrodes 116B and 116D, respectively. Gate electrodes 116A and116C severed from the first stitch region 120 are coupled to gatecontacts 126A and 126B disposed in the second stitch region 122,respectively. The second row of gate contacts 126 disposed in the secondstitch region 122 have the same structure as the first row of gatecontacts 124 illustrated in FIG. 3B. With continuing reference to FIG.2, which shows a left electrode of a pair of the gate electrodes 116 iscouple to a respective one of the gate contacts 126 in the second stitchregion 122 while a right electrode of the pair of the gate electrodes116 is couple to a respective one of the gate contacts 124 in the secondstitch region 120, that is gate electrodes 116A and 116B are coupled togate contacts 126A and 124A, respectively. However, this connectionorder can be reversed for one or more pair of the gate electrodes 116,that is gate electrodes 116A and 116B are coupled to gate contacts 124Aand 126A, respectively, without altering operation of the memory array100.

The gate contacts 124 and 126 may comprise any suitable conductivematerial, such as tungsten silicide (WSi_(x)), titanium silicide(TiSi_(x)), cobalt silicide (CoSi_(x)), nickel silicide (NiSi_(x)),tantalum nitride (TaN_(x)), titanium nitride (TiN_(x)), tantalum (Ta),tungsten (W), titanium (Ti), palladium (Pd), platinum silicide (PtSi),Indium (In), or combinations thereof. The gate contacts 124 and 126 maybe fabricated using a conventional damascene process in a manner as wellknown to one of skill in the art after the formation of the memoryelements 134 or the source lines 118.

FIG. 3C illustrates the cross sectional view of the source contacts 128in the second stitch region 122. The source contacts 128 are disposed inthe trench bottoms 106 and are coupled to the buried source electrodes118 without the gate dielectric layer interposed therebetween. Theformation of the gate electrodes may be prevented by masking the sourcecontact region during the gate electrode film deposition or bysubsequent removal of deposited gate electrode film. It should berecognized that the source contacts 128 may be disposed in the firststitch region 120 or the second stitch region 122 without alteringoperation of the memory array 100. The source contacts 128 may compriseany suitable conductive material, such as tungsten silicide (WSi_(x)),titanium silicide (TiSi_(x)), cobalt silicide (CoSi_(x)), nickelsilicide (NiSi_(x)), tantalum nitride (TaN_(x)), titanium nitride(TiN_(x)), tantalum (Ta), tungsten (W), titanium (Ti), palladium (Pd),platinum silicide (PtSi), Indium (In), or combinations thereof. Thesource contacts 128 may be fabricated using a conventional damasceneprocess in a manner as well known to one of skill in the art after theformation of the memory elements 134 or the source lines 118. The gatedielectric layer covering the trench bottoms 106 is removed during thecontact hole formation step of the damascene process.

Referring now to FIG. 3D, which shows the cross section view of thesubstrate contacts 133 disposed on top of the trench sidewalls 108 inthe second stitch region 122. A respective one of a plurality ofsubstrate lines 142 is coupled to the substrate contacts 133 along thesecond direction for grounding or controlling the substrate potential.The substrate contacts 132 in the first stitch region 120 have the samestructure as the substrate contacts 133 in the second stitch region 122illustrated in FIG. 3D. The substrate contacts 132 and 133 arepreferably disposed on top of trench sidewall regions where the gateelectrodes 116 have been severed in order to minimize the space usage ofthe substrate contacts 132 and 133. The substrate contacts 132 and 133may comprise any suitable conductive material, such as tungsten silicide(WSi_(x)), titanium silicide (TiSi_(x)), cobalt silicide (CoSi_(x)),nickel silicide (NiSi_(x)), tantalum nitride (TaN_(x)), titanium nitride(TiN_(x)), tantalum (Ta), tungsten (W), titanium (Ti), palladium (Pd),platinum silicide (PtSi), Indium (In), or combinations thereof. Thesubstrate contacts 132 and 133 may be fabricated using a conventionaldamascene process in a manner as well known to one of skill in the artafter the formation of the memory elements 134 or the source lines 118.

A memory device may comprise one or more of the memory arrays 100coupled to common sets of word lines and source lines. FIGS. 4A and 4Billustrate an exemplary device having multiple memory arrays 100 coupledto two sets of word lines 144 and 146 extending along the firstdirection substantially parallel to the trenches on two separate levelsabove the memory cells. For reasons of brevity and clarity, theindividual memory arrays 100 are not drawn to scale and only the stitchregions and components therein are shown. The gate contacts 124 and 126are raised above memory cells and are spaced apart with a pitch of 4 Fin the second direction perpendicular to the first direction for amemory cell size of 4 F². Referring now to FIG. 4A, on the first levelthe first set of parallel word lines 144 extending along the trenchdirection are coupled to the gate contacts 124, which are connected tothe gate electrodes 116B, 116D, and 116F formed on the right trenchsidewalls. FIG. 4B shows the second set of parallel word lines 146 onthe second level coupling to the gate contacts 126, which are connectedto the gate electrodes 116A, 116C, and 116E formed on the left trenchsidewalls. Therefore, one of each pair of the gate electrodes 116 formedon a respective pair of the trench sidewalls is connected to arespective one of the first set of word lines 144 and the other one ofeach pair of the gate electrodes 116 is connected to a respective one ofthe second set of word lines 146.

It should be noted that one of each pair of the gate electrodes 116formed on a respective pair of the trench sidewalls is coupled to arespective one of the first row of gate contacts 124 and the other oneof each pair of the gate electrodes 116 formed on a respective pair ofthe trench sidewalls is coupled to a respective one of the second row ofgate contacts 126. Hence, the scheme for connecting the gates electrodes116 to the gate contacts 124 and 126 shown in FIGS. 4A and 4B may bealtered as mentioned afore, which could alter the connection scheme forcoupling the gate contacts 124 and 126 to the word lines 144 and 146.

FIGS. 5A and 5B show another memory device comprising different variantsof memory arrays 100 and 100′ coupled to two sets of parallel word lines148 and 150 on two separate levels. In contrast to the memory array 100(henceforth referred to as Type A), the memory array 100′ (henceforthreferred to as Type B) has an opposite scheme for connecting the gateelectrodes 152 to the gate contacts 124 and 126, wherein the gateelectrodes 152A, 152C, and 152E formed on the left trench sidewalls arecoupled to the first gate contacts 124 and the gate electrodes 152B,152D, and 152F formed on the right trench sidewalls are coupled to thesecond gate contacts 126. FIG. 5A shows the first set of parallel wordlines 148 coupled to the first contacts 124 in Type B array 100′ and tothe second contacts 126 in Type A array 100, which are connected to thegates electrodes formed on the left trench sidewalls. FIG. 5B shows thesecond set of parallel word lines 150 coupled to the second contacts 126in Type B array 100′ and to the first contacts 124 in Type A array 100,which are connected to the gates electrodes formed on the right trenchsidewalls. The current device comprises a plurality of Type A arrays 100and Type B arrays 100′ stitched together in an order of ABABAB. Thepresent word line stitching scheme wherein one of each pair of the gateelectrodes formed on a respective pair of the trench sidewalls isconnected to a respective one of the first set of word lines and theother one of each pair of the gate electrodes is connected to arespective one of the second set of word lines can be applied to allmemory array combinations, such as AAAAAA (FIGS. 4A and 4B), ABABAB(FIGS. 5A and 5B), BBBBBB, AABABB, and so forth.

FIG. 6 illustrates the source contacts 128 of the memory device of FIGS.4A and 4B (Type A array) coupling to a set of parallel source lines 154extending in the trench direction on a separate level from the two setsof word lines 148 and 150. A row of the source contacts 128 disposed ina respective one of the trenches are coupled to a respective one of thesource lines 154. It should be recognized that the present scheme forcoupling the source contacts 128 to the source lines 154 may be extendedto all memory array combinations, such as ABABAB, BBBBBB, AABAAB, and soforth.

The memory cells 112 of the memory array 100 illustrated in FIG. 2 maybe arranged to have a pitch 2 F in the second direction perpendicular tothe trenches, resulting in the first gate contacts 124, the second gatecontacts 126, and the source contacts 128 to have a pitch of 4 F in thesame direction as shown in FIGS. 4A-6. The contacts 124-128 are raisedabove the memory cells 112 for connecting to the first and second set ofword lines 144-150 and the source lines 154 at the metal levels, wheremetallic interconnecting wires are formed. The source lines 154 and thetwo sets of the word lines 144-150 are formed at three separate metallevels. At each level, the source lines 154 or one of the two sets ofthe word lines 144-150 extend along the first direction in between thecontacts 124-128, which are spaced apart in the second direction with apitch of 4 F. The word lines 144-150 and the source lines 154 maycomprise any suitable conductive material, such as copper (Cu), tungsten(W), aluminum (Al), silver (Ag), or alloys thereof and may be fabricatedusing a conventional damascene process in a manner as well known to oneof skill in the art.

While the present invention has been shown and described with referenceto certain preferred embodiments, it is to be understood that thoseskilled in the art will no doubt devise certain alterations andmodifications thereto which nevertheless include the true spirit andscope of the present invention. Thus the scope of the invention shouldbe determined by the appended claims and their legal equivalents, ratherthan by examples given.

What is claimed is:
 1. A memory device comprising: a plurality of memoryarrays formed along a first direction, each of said memory arraysincluding: a memory region comprising an array of memory cells arrangedin an array with a pitch of 2 F in a second direction substantiallyperpendicular to said first direction; and a first and a second stitchregion disposed adjacent said memory region along said first directionhaving a first and second row of gate contacts disposed therein,respectively, said first and second row of gate contacts being arrangedalong said second direction with a pitch of 4 F, each of said first andsecond row of gate contacts being connected to a respective row of saidmemory cells along said first direction; and a first and secondplurality of word lines extending along said first direction, whereineach row of said first and second row of gate contacts of each of saidmemory arrays are coupled to said first or second plurality of wordlines.
 2. A memory device comprising: a semiconductor substrate having aplurality of parallel trenches therein extending along a firstdirection, each of said trenches having a respective pair of a pluralityof paired trench sidewalls; a memory region formed in said semiconductorsubstrate, said memory region including an array of memory cells; aplurality of paired gate electrodes formed on said paired trenchsidewalls, said gate electrodes coupled to said memory cells along saidfirst direction; and a first and a second stitch region disposedadjacent said memory region along said first direction including a firstand a second row of gate contacts, respectively, formed in said trenchesalong a second direction substantially orthogonal to said firstdirection, wherein one of each pair of said gate electrodes is coupledto a respective one of said first row of gate contacts disposed in arespective one of said trenches and the other one of each pair of saidgate electrodes is coupled to a respective one of said second row ofgate contacts disposed in said respective one of said trenches.
 3. Thememory device according to claim 2, wherein each of said trenches has arespective one of said first row of gate contacts and a respective oneof said second row of gate contacts disposed therein.
 4. The memorydevice according to claim 2, wherein said semiconductor substratecomprises silicon.
 5. The memory device according to claim 2, whereinsaid semiconductor substrate has a p-type conductivity.
 6. The memorydevice according to claim 2, wherein said buried source electrodes havean n-type conductivity.
 7. The memory device according to claim 2,wherein said memory cells in said memory region are arranged in a squarearray with a pitch of 2 F in said first and said second direction. 8.The memory device according to claim 2, wherein said first row of gatecontacts and said second row of gate contacts are arranged to have apitch of 4 F in said second direction.
 9. The memory device according toclaim 2, further comprising: a first and a second plurality ofsubstrates contacts coupled to said substrate in said first and saidsecond stitch region, respectively; and a plurality of parallelsubstrate lines coupled to said first and said second plurality ofsubstrate contacts along said second direction.
 10. The memory deviceaccording to claim 9, wherein said first and said second plurality ofsubstrate contacts are disposed on top of trench sidewall regions wheresaid gate electrodes have been severed.